Application of insulating board in power distribution room
With the further development of power technology, the security and stability of power supply are becoming more and more important.
Insulating board refers to the organic macromolecular compound with two or more epoxy groups in its molecule. Except for a few, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, which can be located at the end, middle or in a circular structure. Because the molecular structure contains active epoxy groups, they can be cross-linked with various types of curing agents to produce insoluble, non fusible polymers with three-dimensional network structure.
Features of insulating board:
1. Various forms. All kinds of resins, curing agents and modifier systems can be almost applicable to the requirements of various applications for forms, ranging from very low viscosity to high melting point solids.
2. Easy curing. With various curing agents, the epoxy resin system can almost be cured in the temperature range of 0~180 ℃.
3. Strong adhesion. The existence of polar hydroxyl and ether bond in epoxy resin molecular chain makes it have high adhesion to various substances. The epoxy resin has low shrinkage and low stress when curing, which also helps to improve the adhesion strength.
4. Low shrinkage. The reaction between the epoxy resin and the curing agent used is based on the direct addition reaction or ring opening polymerization of the epoxy group in the resin molecule, and no water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.
5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.
